Inspection method
AssigneeDisco Corporation
InventorNaoko Yamamoto
Life of this patent
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Abstract
An inspection method for a divided wafer includes a wafer lamination step of stacking a transfer wafer on top of a wafer that has been divided into a plurality of chips, a particle transfer step of, after the wafer lamination step is carried out, positioning the transfer wafer on a lower side and the divided wafer on an upper side and applying a vibration to the wafer stacked on the transfer wafer, to drop particles adhering to side surfaces of the chips onto the transfer wafer, and an inspection step of, after the particle transfer step is carried out, inspecting the particles on the transfer wafer.
Claims3
An inspection method for a divided wafer, the inspection method comprising:
- a wafer lamination step of stacking a transfer wafer on top of a wafer that has been divided into a plurality of pieces;
- a particle transfer step of, after the wafer lamination step is carried out, positioning the transfer wafer on a lower side and the divided wafer on an upper side and applying a vibration to the wafer stacked on the transfer wafer, to drop particles adhering to side surfaces of the divided pieces onto the transfer wafer;
- and
- an inspection step of, after the particle transfer step is carried out, inspecting the particles on the transfer wafer.
Dependencies are inferred from the claim text.