Transfer device, transfer system, and end effector

A transfer system comprising:

• a vacuum transfer module;
• at least one first wafer processing module connected to the vacuum transfer module;
• at least one second wafer processing module connected to the vacuum transfer module;
• and
• a vacuum transfer robot disposed in the vacuum transfer module for simultaneously or separately transferring a wafer and a circular consumable part in a vacuum atmosphere,
• wherein the consumable part is disposed in said at least one first wafer processing module,
• the outer diameter of the consumable part is larger than the outer diameter of the wafer,
• the vacuum transfer robot includes an end effector configured to place the wafer and the consumable part thereon simultaneously or separately,
• the end effector is configured to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector,
• the end effector includes:
• a first wafer support pad disposed in a first front end region and having a first height;
• a second wafer support pad disposed in a second front end region and having the first height;
• a third wafer support pad disposed in a rear end region and having the first height, and
• the first wafer support pad, the second wafer support pad and the third wafer support pad are vacuum pads configured to attract and hold members by sucking air.

An end effector for placing a wafer and a consumable part having a circular shape thereon simultaneously or separately, wherein the outer diameter of the consumable part is larger than the outer diameter of the wafer,

• the end effector comprising:
• a main body having an upper surface having a first front end region, a second front end region, and a rear end region, wherein the first front end region and the second front end region overlap each other when viewed from a first direction;
• a first wafer support pad disposed in the first front end region and having a first height;
• a second wafer support pad disposed in the second front end region and having the first height;
• a third wafer support pad disposed in the rear end region and having the first height;
• a first consumable part support pad disposed between the first wafer support pad and front ends of the end effector in the first front end region and having a second height different from the first height;
• a second consumable part support pad disposed between the second wafer support pad and the front ends of the end effector in the second front end region and having the second height;
• and
• a third consumable part support pad disposed between the third wafer support pad and a rear end of the end effector in the rear end region and having the second height,
• the end effector is configured to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position in the case of transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and the front ends of the end effector in the case of transferring the wafer, and
• the first wafer support pad, the second wafer support pad and the third wafer support pad are vacuum pads configured to attract and hold members by sucking air.