Wafer placement table and method of manufacturing the same
AssigneeNGK Insulators, Ltd.
InventorsMasaki Ishikawa, Yuji Akatsuka
Life of this patent
Estimating the term…
Loading patent…
AssigneeNGK Insulators, Ltd.
InventorsMasaki Ishikawa, Yuji Akatsuka
Estimating the term…
A wafer placement table includes a first ceramic substrate having a wafer placement surface on an upper surface; a second ceramic substrate disposed on a lower surface side of the first ceramic substrate; a metal bonding layer that bonds a lower surface of the first ceramic substrate and an upper surface of the second ceramic substrate; a connection member including an upper base and a lower base, the connection member being embedded in the second ceramic substrate with the upper base in contact with the metal bonding layer; and a power supply terminal electrically connected to the lower base of the connection member, wherein the connection member has a portion in which an area of cross section when the connection member is cut by a plane parallel to the upper base increases from a side of the upper base to a side of the lower base.
A wafer placement table comprising:
A method of manufacturing a wafer placement table, the method comprising:
A wafer placement table comprising:
Dependencies are inferred from the claim text.