Semiconductor processing tool and method of using an embedded chamber

A method comprising:

• loading a workpiece including a patterned photoresist layer into a loading area of a pattern transfer processing chamber, the loading area including an embedded baking chamber, the loading area and the embedded baking chamber being external from the pattern transfer processing chamber, wherein the embedded baking chamber is within an atmospheric space;
• heating the workpiece including the patterned photoresist layer in the embedded baking chamber;
• applying a first vacuum to the workpiece including the patterned photoresist layer with a load-lock;
• transferring the workpiece including the patterned photoresist layer from the load-lock to the pattern transfer processing chamber, wherein the pattern transfer processing chamber has an atmosphere with a second vacuum;
• and
• performing a pattern transfer operation on the workpiece including the patterned photoresist layer within the pattern transfer processing chamber.

A method comprising:

• loading a workpiece including a patterned photoresist layer into a load-lock that is within a load area of a pattern transfer processing chamber, wherein the load area is external from the pattern transfer processing chamber;
• heating the workpiece including the patterned photoresist layer in an embedded baking chamber that is present within the load-lock;
• applying a first vacuum to the workpiece including the patterned photoresist layer within the load-lock;
• transferring the workpiece including the patterned photoresist layer from the load-lock to the pattern transfer processing chamber;
• wherein the pattern transfer processing chamber has an atmosphere with a second vacuum;
• and
• performing a pattern transfer operation on the workpiece including the patterned photoresist layer within the pattern transfer processing chamber.