US 12,191,170 B2 · Heater and heating base

Abstract

The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.

Claims20

Dependent claims

A heater for a semiconductor process apparatus comprising:

a heating body;
and
a base configured to support the heating body and including:
a base body arranged at a distance from the heating body;
and
a wall connected to the base body, arranged between the base body and the heating body, and fixedly connected to the heating body, an elastic bending structure being arranged on the base body and being configured to generate an elastic deformation to maintain the connection between the wall and the heating body when the wall and/or the base body expand to deform.

3 more elements

A heating base comprising:

a heater including:
a heating body;
and
a base configured to support the heating body and including:
a base body arranged at a distance from the heating body, a first center hole being arranged in the base;
and
a wall connected to the base body, arranged between the base body and the heating body, and fixedly connected to the heating body, an elastic bending structure being arranged on the base body and being configured to generate an elastic deformation to maintain the connection between the wall and the heating body when the wall and/or the base body expand to deform;
an insulation disc arranged at a bottom of the base and sealedly connected to the base to seal the first center hole, a second center hole corresponding to the first center hole being arranged in the insulation disc;
and
a bellows sealedly connected to a side of the insulation disc away from the heater to seal the second center hole.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/174,336Filed 24 Feb 2023 · continuation

Priority

CN 202010862303.X25 Aug 2020

Published

US 2023/0223282 A113 Jul 2023

Granted

7 Jan 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10P 72/0432
Apparatus for thermal treatment: mainly by conduction
H05B 3/06
Details: heater elements structurally combined with coupling elements or holders
H05B 3/22
Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater: non-flexible
H10P 72/0434
Apparatus for thermal treatment: mainly by convection

Heater and heating base

Life of this patent

Heater and heating base

Life of this patent

Abstract

Claims20