Wafer transfer system and method of use

A wafer transfer system, comprising:

• a transfer chamber forming a volume, the transfer chamber comprising a wafer support within the volume to support a wafer;
• a first input gas nozzle, disposed above the wafer support within the transfer chamber, to input a first flow of a first gas into the transfer chamber at a first flow speed;
• a second input gas nozzle, disposed below the wafer support within the transfer chamber, to input a second flow of a second gas into the transfer chamber at a second flow speed different than the first flow speed;
• a first output gas structure to guide at least one of the first gas or the second gas from the transfer chamber due to the second flow speed being different from the first flow speed such that suspended particles within the transfer chamber are at least one of directed away from the wafer support or directed toward the first output gas structure to guide the suspended particles from the transfer chamber;
• and
• a controller to control a first direction of the first input gas nozzle about a first axis of rotation to control a direction of gas flow within the transfer chamber and to control a second direction of the first input gas nozzle about a second axis of rotation to control the direction of gas flow within the transfer chamber.

A wafer transfer system, comprising:

• a transfer chamber defining a volume, the transfer chamber comprising a wafer support within the volume to support a wafer;
• a first set of gas nozzles, comprising:
• a first input gas nozzle, disposed above the wafer support within the transfer chamber, to input a first flow of a first gas into the transfer chamber at a first flow speed;
• and
• a first output gas nozzle disposed above the wafer support;
• a second set of gas nozzles, comprising:
• a second input gas nozzle, disposed below the wafer support within the transfer chamber, to input a second flow of a second gas into the transfer chamber at a second flow speed different than the first flow speed;
• and
• a first output gas structure to guide at least one of the first gas or the second gas from the transfer chamber due to the second flow speed being different than the first flow speed such that suspended particles within the transfer chamber are at least one of directed away from the wafer support or directed toward the first output gas structure to guide the suspended particles from the transfer chamber, wherein the first output gas structure is configured as a second output gas nozzle disposed below the wafer support;
• and
• a controller to control a first direction of the first input gas nozzle dynamically about a first axis of rotation, a second direction of the first output gas nozzle dynamically about a second axis of rotation, a third direction of the second input gas nozzle dynamically about a third axis of rotation, and a fourth direction of the second output gas nozzle dynamically about a fourth axis of rotation to dynamically control a direction of gas flow within the transfer chamber.