Substrate processing apparatus, substrate processing system and substrate processing method
AssigneeTokyo Electron Limited
InventorsMunehisa Kodama, Tomohiro Kaneko
Life of this patent
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AssigneeTokyo Electron Limited
InventorsMunehisa Kodama, Tomohiro Kaneko
Estimating the term…
A substrate processing apparatus includes a pair of first substrate chucks each configured to hold a substrate from below while allowing a first main surface of the substrate to face upwards; a pair of second substrate chucks each configured to hold the substrate from below while allowing a second main surface of the substrate opposite to the first main surface to face upwards; a rotary table which is configured to be rotated about a rotation axis; a first processing unit equipped with a first processing tool configured to process the first main surface of the substrate held by the first substrate chuck; and a second processing unit equipped with a second processing tool configured to process the second main surface of the substrate held by the second substrate chuck.
A substrate processing apparatus, comprising:
A substrate processing method, comprising:
Dependencies are inferred from the claim text.