Switching device and method for manufacturing the same
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation, Kochi Prefectural Public University Corporation
InventorsHidemoto Tomita, Takashi Okawa, Toshiyuki Kawaharamura, Li Liu
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Abstract
A switching includes a gallium nitride semiconductor and a gate insulation film. The gate insulation film is made of silicon oxide and disposed above the gallium nitride semiconductor layer. An interface between the gallium nitride insulation film and the gate insulation film is either free of a gallium oxide layer or provided with the gallium oxide layer with a thickness of 1 nanometer or smaller.
Claims5
A switching device comprising:
- a gallium nitride semiconductor layer;
- and
- a gate insulation film made of silicon oxide and disposed above the gallium nitride semiconductor layer,
- wherein an interface between the gallium nitride semiconductor layer and the gate insulation film is either free of a gallium oxide layer or provided with the gallium oxide layer with a thickness of 1 nanometer or smaller, and
- a dipole is not formed across the interface between the gallium nitride semiconductor layer and the gate insulation film.
A switching device comprising:
- a gallium nitride semiconductor layer;
- and
- a gate insulation film made of silicon oxide and disposed above the gallium nitride semiconductor layer,
- wherein an interface between the gallium nitride semiconductor layer and the gate insulation film is free of a gallium oxide layer.
A switching device comprising:
- a gallium nitride semiconductor layer;
- a silicon oxide gate insulation film disposed above the gallium nitride semiconductor layer;
- and
- a dipole-free interface between the gallium nitride semiconductor layer and the silicon oxide gate insulation film that is either free of a gallium oxide layer or that includes the gallium oxide layer with a thickness of 1 nm or less.
Dependencies are inferred from the claim text.