Method for manufacturing a component arrangement for a package, method for manufacturing a package having a component arrangement, a component arrangement and a package

A method for manufacturing a component arrangement for a package, comprising:

• providing a wafer of a semiconductor material having a polished wafer surface;
• forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured in a region of the opening;
• separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces:
• an optical surface formed in a region of a surface portion of the polished wafer surface, and
• a mounting surface formed in the region of the anisotropically etched surface;
• and
• mounting the separated component on a substrate surface of a support substrate using the mounting surface, in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein hereby the optical surface is arranged as an inclined exposed surface;
• wherein the mounting surface is formed having a mounting functional layer manufactured in a region of the mounting surface, and the mounting functional layer is manufactured having a solderable metal coating.