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US 12,191,122 B2Granted
Electrostatic chuck with spatially tunable RF coupling to a wafer
AssigneeLam Research Corporation
InventorJohn Drewery
Life of this patent
Estimating the term…
Abstract
A substrate support assembly to support a semiconductor substrate in a processing chamber includes a baseplate arranged in the processing chamber, a dielectric layer arranged on the baseplate to support the semiconductor substrate, an electrode disposed in the dielectric layer along a horizontal plane, and a plurality of channels to carry a fluid. The plurality of channels are disposed in the dielectric layer along the horizontal plane on a side of the electrode facing away from the baseplate.
Claims38
A substrate support assembly to support a semiconductor substrate in a processing chamber, the substrate support assembly comprising:
- a baseplate arranged in the processing chamber;
- a dielectric layer arranged on the baseplate to support the semiconductor substrate;
- an electrode disposed in the dielectric layer along a horizontal plane;
- a first plurality of interconnected channels having an inlet and an outlet that is separate from the inlet to carry a liquid, wherein the first plurality of channels are disposed in the dielectric layer along the horizontal plane on a side of the electrode facing away from the baseplate;
- and
- a controller programmed to control liquid level in the first plurality of channels to vary permittivity of material between the electrode and the semiconductor substrate and to adjust amount of power delivered from the electrode to the semiconductor substrate.
3 more elements
Dependencies are inferred from the claim text.