Method for fabricating a micro resistance layer and method for fabricating a micro resistor

A method for fabricating a micro resistor, comprising:

• providing a substrate, wherein the substrate has a first surface and a second surface opposite to the first surface, a plurality of resistor regions are defined on the substrate, and an area of each of the resistor regions is smaller than or equal to 0.4*0.2 mm2;
• forming a plurality of first inner electrode pairs on the first surface, wherein each of the resistor regions encompasses one of the first inner electrode pairs;
• forming a plurality of second inner electrode pairs on the second surface, wherein each of the resistor regions encompasses one of the second inner electrode pairs;
• forming a first resistance layer on the first surface of the substrate by using a screen printing process to cover the resistor regions;
• dividing the first resistance layer into a plurality of second resistance layers, wherein each of the resistor regions encompasses one of the second resistance layers, and each of the second resistance layers is smaller than 0.4*0.2 mm2;
• trimming a pattern of the second resistance layer of each of the resistor regions in accordance with a predetermined resistance value to enable the pattern of the second resistance layer of each of the resistor regions to correspond to the predetermined resistance value;
• dividing the substrate into a plurality of substrate strips in accordance with the resistor regions;
• forming an outer electrode layer on each of the substrate strips, wherein the outer electrode layer comprises a side electrode layer, and is electrically connected to the first inner electrode pair, the second inner electrode pair and the second resistance layer of each of the resistor regions;
• and
• dividing each of the substrate strips in accordance with the resistor regions to obtain a plurality of micro resistors each having an area smaller than or equal to 0.4*0.2 mm2.

A method for fabricating a micro resistor, comprising:

• providing a substrate, wherein the substrate has a first surface and a second surface opposite to the first surface, a plurality of resistor regions are defined on the substrate, and an area of each of the resistor regions is smaller than or equal to 0.4*0.2 mm2;
• forming a plurality of first inner electrode pairs on the first surface, wherein each of the resistor regions encompasses one of the first inner electrode pairs;
• forming a plurality of second inner electrode pairs on the second surface, wherein each of the resistor regions encompasses one of the second inner electrode pairs;
• forming a first resistance layer on the first surface of the substrate by using a screen printing process to cover the resistor regions;
• dividing the first resistance layer into a plurality of second resistance layers, wherein each of the resistor regions encompasses one of the second resistance layers, and each of the second resistance layers is smaller than 0.4*0.2 mm2;
• trimming a pattern of the second resistance layer of each of the resistor regions in accordance with a predetermined resistance value to enable the pattern of the second resistance layer of each of the resistor regions to correspond to the predetermined resistance value;
• performing an outer electrode forming step to form an outer electrode layer in each of the resistor regions, wherein the outer electrode layer comprises a side electrode layer, and is electrically connected to the first inner electrode pair, the second inner electrode pair and the second resistance layer of each of the resistor regions;
• and
• dividing the substrate in accordance with the resistor regions to obtain a plurality of micro resistors each having an area smaller than or equal to 0.4*0.2 mm2.