Electronic package structure

An electronic package structure, comprising:

• a carrier;
• a first electronic component disposed adjacent to the carrier, wherein the first electronic component comprises a heat source region configured to maintain a constant temperature of a second electronic component which is disposed over the heat source region, and a backside surface of the second electronic component is thermally connected to the heat source region by a thermal bonding layer;
• and
• a wire electrically connecting the first electronic component and the carrier, wherein the wire has a first end and a second end opposite to the first end, and the first end is substantially at a same level with the second end, wherein the second end of the wire is on the carrier and below a top surface of the carrier.