Back to results
US 12,184,265 B2Granted
Resonator package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Yoon Kim, Yeong Gyu Lee, Moon Chul Lee, Jae Chang Lee, Duck Hwan Kim
Life of this patent
Estimating the term…
Abstract
A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
Claims13
A method of manufacturing a resonator package, the method comprising:
- etching a lower electrode with a hardmask into at least two portions having different thicknesses;
- depositing a dielectric layer on the etched lower electrode on the at least two portions with different thicknesses,
- wherein only a portion of an upper surface of the lower electrode is etched to shape the lower electrode to have the at least two portions with different thicknesses, and
- wherein the etching of the lower electrode comprises:
- performing a first hardmask etching process on the hardmask provided on the upper surface of the lower electrode to obtain a first etched hardmask;
- performing a first electrode etching process on the lower electrode using the first etched hardmask such that only a portion of the upper surface of the lower electrode is etched;
- performing a second hardmask etching process on the first etched hardmask to obtain a second etched hardmask;
- and
- performing a second electrode etching process on the first etched lower electrode using the second etched hardmask.
6 more elements
A method of manufacturing a resonator package, the method comprising:
- disposing an insulating layer on a substrate;
- disposing a piezoelectric layer on the insulating layer;
- disposing a lower electrode comprising two portions having different thicknesses directly on an upper surface of the piezoelectric layer,
- disposing a dielectric layer directly on an upper surface of the lower electrode and directly on a sidewall of the lower electrode;
- and
- disposing an upper electrode directly on an upper surface of the dielectric layer,
- wherein the disposing of the lower electrode comprises etching the lower electrode with a hardmask patterned into two different shapes so that the upper surface of the lower electrode is etched to shape the two portions of the lower electrode having different thicknesses, and
- the etching of the lower electrode comprises:
- performing a first hardmask etching process on a hardmask disposed on the upper surface of the lower electrode to obtain a first etched hardmask;
- performing a first electrode etching process on the lower electrode using the first etched hardmask so that only a portion of the upper surface of the lower electrode is etched;
- performing a second hardmask etching process on the first etched hardmask to obtain a second etched hardmask;
- and
- performing a second electrode etching process on the first etched lower electrode using the second etched hardmask.
10 more elements
Dependencies are inferred from the claim text.