Filter radio frequency module packaging structure and method for manufacturing same

A filter radio-frequency module packaging structure, comprising:

• a substrate;
• an encapsulating material;
• and at least two chips with different functions, wherein
• the at least two chips with different functions comprise a first filter chip, a packaging circuit is arranged on the substrate, and the first filter chip comprises a chip body and a wall structure arranged on the chip body of the first filter chip,
• the chip body of the first filter chip has a functional area configured to realize a filtering function, wherein the functional area is located on a functional surface of the chip body of the first filter chip, and chip pins of the first filter chip are provided on the functional surface,
• the first filter chip is flip-mounted on the substrate and the chip pins are electrically connected to the packaging circuit on the substrate,
• the wall structure is arranged on the functional surface of the chip body, and the wall structure, the functional surface and the substrate jointly form a closed cavity, or the wall structure and the functional surface jointly form a closed cavity,
• the at least two chips with different functions further comprise a non-filter chip, wherein the non-filter chip is electrically connected to the packaging circuit on the substrate through flip-mounting or wire bonding processes, and
• the encapsulating material and the substrate encapsulate the at least two chips with different functions.