Surface-mount amplifier devices

A surface-mount device, comprising:

• a package body including a central flange configured to conduct heat to a heatsink;
• and
• an amplifier module mounted to the central flange of the surface-mount device, the amplifier module comprising:
• a module substrate mounted to the central flange, the module substrate including a first die mount window,
• a first circuitry on a first surface of the module substrate,
• a second circuitry on the first surface of the module substrate, and
• a first amplifier die mounted directly to the central flange, wherein the first amplifier die is at least partially disposed within the first die mount window and does not physically contact the module substrate and the first amplifier die is electrically connected to the first circuitry and the second circuitry, and wherein the first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

A method of manufacturing a surface-mount device, comprising:

• mounting a substrate to a central flange of the surface-mount device, wherein the central flange is configured to conduct heat to a heatsink, wherein the substrate includes a first circuitry and a second circuitry on a first surface of the substrate and a die mount window;
• mounting a first amplifier die to the central flange through the die mount window;
• and
• electrically connecting the first amplifier die to the first circuitry and the second circuitry.