Shielded connector assemblies with temperature and alignment controls

A wafer assembly, comprising:

• a ground path assembly comprising a first ground shield and a second ground shield;
• and
• a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, with a first pair of communication signal conductors extending along the first ground shield and a second pair of the communication signal conductors extending along the second ground shield, wherein:
• the communication signal conductors comprise a plurality of high-speed communication signal conductors and a plurality of low-speed communication signal conductors;
• and
• the plurality of low-speed communication signal conductors are centrally positioned in the row of conductors in a gap between the first ground shield and the second ground shield.

A wafer assembly, comprising:

• a ground path assembly comprising a first ground shield and a second ground shield;
• and
• a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, with a first pair of communication signal conductors extending along the first ground shield and a second pair of the communication signal conductors extending along the second ground shield, wherein:
• the first ground shield comprises a dual ground path for a first ground conductor among the plurality of ground conductors;
• the first ground conductor comprises a contact tip portion and a tail portion;
• the first ground shield comprises conductive spring fingers inserted into channels in the first ground shield;
• and
• the conductive spring fingers contact a top surface of the first ground conductor.

A wafer assembly, comprising:

• a ground path assembly comprising a first ground shield and a second ground shield;
• and
• a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein:
• the first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors with a gap separating the first ground shield and the first pair of communication signal conductors from the second ground shield and the second pair of communication signal conductors;
• the row of conductors comprises a conductor with an offset from an extension axis;
• and
• the conductor with the offset is positioned in the gap between the first ground shield and the second ground shield.