Stacked large-capacity signal acquisition and transmission system and design method thereof

A stacked large-capacity signal acquisition and transmission system, comprising an adapter board, n acquisition boards, central control boards and a communication board sequentially laminated;

• wherein component layout of each of the acquisition boards is the same;
• the adapter board is provided with circuit board interfaces and n first board-level connectors;
• in the adapter board, the circuit board interfaces are used for connecting external signal input interfaces, and the circuit board interfaces are connected with each of the first board-level connectors;
• an m-th acquisition board is provided with a signal acquisition and conditioning module, at least n−m+1 second board-level connectors and at least m third board-level connectors;
• in the acquisition boards, an input end and an output end of the signal acquisition and conditioning module are respectively connected with one of the second board-level connectors and the third board-level connectors;
• wherein m and n are integer numbers, and 1≤m≤n;
• each central control board is provided with a signal conversion module, at least one fourth board-level connector and at least one fifth board-level connector;
• an input end and an output end of the signal conversion module are respectively connected with the fourth board-level connector and the fifth board-level connector;
• the communication board is provided with a communication module and sixth board-level connectors;
• the communication board is used for communicating with an upper computer;
• a connection between the adapter board and a first acquisition board is realized by splicing the first board-level connectors and the second board-level connectors;
• a connection of each of the acquisition boards is realized by splicing the second board-level connectors and the third board-level connectors respectively;
• a connection between a last acquisition board and the central control board through a splicing of the third board-level connectors and the fourth board-level connectors;
• a connection between the central control board and the communication board is realized by a splicing of the fifth board-level connectors and the sixth board-level connectors;
• and when each of the acquisition boards is connected, the second board-level connectors and the third board-level connectors respectively connected with the input end and the output end of the signal acquisition and conditioning module are located at different projection positions.