Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel

A manufacturing method for an integrated chip, the method being used for forming and processing an electrode structure of the integrated chip and the method comprising:

• manufacturing a light-emitting portion that comprises n×m light-emitting unit groups distributed in a form of a matrix, wherein n denotes a number of rows, m denotes a number of columns, n and m are each a positive integer greater than or equal to 1, each of the n×m light-emitting unit groups comprises x×y light-emitting units distributed in a form of a matrix, wherein x denotes a number of rows, y denotes a number of columns, and x and y are each a positive integer greater than or equal to 1, and each of the x×y light-emitting units comprises electrode a and electrode b;
• and electrically connecting electrodes a of a same column of light-emitting units in a same column of light-emitting unit groups to form a same first electrode so that a total of m×y first electrodes are formed, and electrically connecting electrodes b of a same row of light-emitting units in a same row of light-emitting unit groups to form a same second electrode so that a total of n×x second electrodes are formed;
• and
• electrically leading out conductive terminals of the m×y first electrodes and conductive terminals of the n×x second electrodes so that m×y first pin electrodes and n×x second pin electrodes are formed, wherein the m×y first pin electrodes and the n×x second pin electrodes are used for being electrically connected to a circuit substrate.