LED module, method for manufacturing LED module, and circuit board

A circuit board, comprising:

• a first electrode for connecting a cathode electrode of an LED;
• a second electrode for connecting an anode electrode of the LED;
• a first bump disposed on the first electrode;
• and a second bump disposed on the second electrode, wherein the shapes of the first bump and the second bump are different, wherein the first bump includes a first spherical body and a second spherical body on the first electrode, each of the first spherical body and the second spherical body is in direct contact with the first electrode, a height of the first spherical body from a top surface of the first electrode is smaller than a height of the second spherical body from the top surface of the first electrode, and the first bump has a shape in which the first spherical body and the second spherical body are fused.