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US 12,183,847 B2Granted
Method for manufacturing supporting substrate for semiconductor light-emitting device
AssigneeWavelord Co., Ltd
InventorJune O Song
Life of this patent
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Abstract
Disclosed is a method for manufacturing a supporting substrate for a semiconductor light emitting device, the method including: preparing a substrate having a groove; introducing a material into the groove of the substrate, the material serving to form a thermal and/or electrical pass; and compressing the material inwards from both ends of the groove, using a compressing means.
Claims13
A method for manufacturing a supporting substrate for a semiconductor light emitting device, comprising:
- preparing a substrate having a groove;
- forming a metal layer on an upper side of the substrate and only within the groove to enhance adhesion and to form an electrical pass;
- introducing a material into the groove of the substrate where the metal layer is formed inside, the material serving to form a thermal and/or electrical pass;
- compressing the material inwards from both ends of the groove, using a compressing means;
- and
- polishing both sides of the substrate to remove a portion of the material stuck out of the groove and the metal layer on the upper side of the substrate,
- wherein the material and the metal layer are kept or confined within both ends of the groove, and
- wherein both ends of the material and the metal layer are directly exposed to the outside to form the thermal and/or electrical pass inside the substrate.
5 more elements
A method for manufacturing a supporting substrate for a semiconductor light emitting device, comprising:
- preparing a substrate having a groove;
- forming a metal layer on an upper side of the substrate and only within the groove to enhance adhesion and to form an electrical pass;
- introducing a material into the groove of the substrate where the metal layer is formed inside, the material serving to form a thermal and/or electrical pass arranged on an auxiliary substrate provided with a sacrificial layer;
- separating, from the substrate, the auxiliary substrate with respect to the sacrificial layer;
- and
- polishing both sides of the substrate to remove a portion of the material stuck out of the groove and the metal layer on the upper side of the substrate,
- wherein the material and the metal layer are kept or confined within both ends of the groove, and
- wherein both ends of the material and the metal layer are directly exposed to the outside to form the thermal and/or electrical pass inside the substrate.
5 more elements
Dependencies are inferred from the claim text.