Device and method for removing metal gallium, and laser lift-off system
AssigneeChongqing Konka Photoelectric Technology Research Institute Co., Ltd.
InventorsChunlin Fan, Bin Wang, Qing Wang
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Abstract
The present disclosure relates to a device and method for removing metal gallium, and a laser lift-off system. The device includes a device body, and the device body includes a process chamber (10), wherein fluid used for removing metal gallium left on the surfaces of multiple Micro Light Emitting Diode (Micro-LED) chips after laser lift-off is contained in the process chamber (10); and a temperature of the fluid is greater than or equal to a melting point of metal gallium.
Claims19
A device for removing metal gallium, the device for removing metal gallium is placed inside a lift-off chamber, comprising:
- a device body, comprising a process chamber;
- wherein fluid used for removing metal gallium left on surfaces of multiple Micro Light Emitting Diode (Micro-LED) chips after laser lift-off performed by a laser lift-off device is contained in the process chamber, wherein the laser lift-off device comprises the lift-off chamber;
- and
- a temperature of the fluid is greater than or equal to a melting point of metal gallium.
A method for removing metal gallium based on a device for removing metal gallium, wherein the device comprises a process chamber;
- the method comprises:
- providing a temporary storage substrate after laser lift-off performed by a laser lift-off device, wherein multiple Micro Light Emitting Diode (Micro-LED) chips are adhered to the temporary storage substrate, wherein the laser lift-off device comprising a lift-off chamber, the device for removing metal gallium is placed inside the lift-off chamber;
- transferring the temporary storage substrate into the process chamber;
- and
- introducing a specific amount of fluid into the process chamber to remove residual metal gallium on surfaces of the multiple Micro-LED chips,
- wherein a temperature of the fluid is greater than or equal to a melting point of metal gallium.
A laser lift-off system, comprising:
- a laser lift-off device, configured to separate a temporary storage substrate adhered with multiple Micro Light Emitting Diode (Micro-LED) chips from a growth substrate;
- a device for removing metal gallium, wherein the device comprises a process chamber, and fluid used for removing metal gallium left on the surfaces of the multiple Micro-LED (Micro-LED) chips after laser lift-off is contained in the process chamber, and a temperature of the fluid is greater than or equal to a melting point of metal gallium;
- and
- a transfer device, configured to transfer the temporary storage substrate after laser lift-off into the process chamber;
- wherein the laser lift-off device further comprises a lift-off chamber inside which the device for removing metal gallium is placed.
Dependencies are inferred from the claim text.