Semiconductor devices and methods of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKo-Cheng Liu, Chang-Miao Liu
Life of this patent
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKo-Cheng Liu, Chang-Miao Liu
Estimating the term…
A semiconductor structure and a method of forming the same are provided. In an embodiment, an exemplary method includes providing a workpiece having a first active region and a second active region protruding from a substrate, lined by cladding layers, and spaced by a first trench. The method also includes forming a dielectric layer over the workpiece to substantially fill the first trench, forming a mask film directly on a portion of the dielectric layer in the first trench after the forming of the dielectric layer, selectively recessing the dielectric layer after the forming of the mask film to form a dummy fin in and protruding from the first trench, performing an etching process to selectively remove the cladding layers to form second trenches, and forming a gate structure over the workpiece to fill the second trenches.
A method, comprising:
A method, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.