Semiconductor device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsJin-Yan Chiou, Wei-Chuan Tsai, Yen-Tsai Yi, Hsiang-Wen Ke
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AssigneeUnited Microelectronics Corp.
InventorsJin-Yan Chiou, Wei-Chuan Tsai, Yen-Tsai Yi, Hsiang-Wen Ke
Estimating the term…
A method for fabricating semiconductor device includes the steps of first forming a gate structure on a substrate, forming a source/drain region adjacent to two sides of the gate structure, forming an epitaxial layer on the source/drain region, forming an interlayer dielectric (ILD) layer on the gate structure, forming a contact hole in the ILD layer to expose the epitaxial layer, forming a low stress metal layer in the contact hole, forming a barrier layer on the low stress metal layer, and forming an anneal process to form a first silicide layer and a second silicide layer.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.