Photoelectric conversion apparatus, photoelectric conversion system, mobile body, and semiconductor substrate

An apparatus comprising:

• a first substrate having a pixel area in which a plurality of pixels is arranged;
• a second substrate superimposed on the first substrate and electrically connected to the first substrate;
• a first processing unit for processing signals output from the plurality of pixels;
• and
• a second processing unit for performing processing based on a calculation model on a signal output from the first processing unit, and arranged at a position different from a position at which the first processing unit is arranged,
• at least part of the first processing unit and at least part of the second processing unit being disposed on either the first substrate or the second substrate,
• the second substrate comprising:
• a plurality of first wirings which are electrically connected to the first processing unit and which are disposed at positions so as to overlap the first processing unit when seen in a plan view,
• a plurality of second wirings which are electrically connected to the second processing unit and which are disposed at positions so as to overlap the second processing unit when seen in a plan view,
• a wiring density of the plurality of second wirings being different from a wiring density of the plurality of first wirings,
• a plurality of first pads to which the plurality of first wirings is connected;
• and
• a plurality of second pads to which the plurality of second wirings is connected,
• wherein the second pads are larger in number than the first pads.

An apparatus comprising:

• a first substrate having a pixel area in which a plurality of pixels is arranged;
• a second substrate superimposed on the first substrate and electrically connected to the first substrate;
• a first processing unit for processing signals output from the plurality of pixels;
• and
• a second processing unit for performing processing based on a calculation model on a signal output from the first processing unit, and arranged at a position different from a position of the first processing unit,
• at least part of the first processing unit and at least part of the second processing unit being disposed on either the first substrate or the second substrate,
• the second substrate comprising:
• a plurality of first wirings which are electrically connected to the first processing unit and which are disposed at positions so as to overlap the first processing unit when seen in a plan view,
• a plurality of second wirings which are electrically connected to the second processing unit and which are disposed at positions so as to overlap the second processing unit when seen in a plan view,
• a wiring density of the plurality of second wirings being different from a wiring density of the plurality of first wirings,
• a plurality of first pads to which the plurality of first wirings is connected;
• and
• a plurality of second pads to which the plurality of second wirings is connected,
• wherein the second pads are smaller in number than the first pads.