Fluorine passivation in a pixel sensor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Lin Chen, Chun-Hao Chou, Kuo-Cheng Lee
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Lin Chen, Chun-Hao Chou, Kuo-Cheng Lee
Estimating the term…
Implementations described herein reduce electron-hole pair generation due to silicon dangling bonds in pixel sensors. In some implementations, the silicon dangling bonds in a pixel sensor may be passivated by silicon-fluorine (Si—F) bonding in various portions of the pixel sensor such as a transfer gate contact via or a shallow trench isolation region, among other examples. The silicon-fluorine bonds are formed by fluorine implantation and/or another type of semiconductor processing operation. In some implementations, the silicon-fluorine bonds are formed as part of a cleaning operation using fluorine (F) such that the fluorine may bond with the silicon of the pixel sensor. Additionally, or alternatively, the silicon-fluorine bonds are formed as part of a doping operation in which boron (B) and/or another p-type doping element is used with fluorine such that the fluorine may bond with the silicon of the pixel sensor.
A method, comprising:
A method, comprising:
A method of forming a pixel sensor, comprising:
Dependencies are inferred from the claim text.