Semiconductor package with dummy MIM capacitor die

A semiconductor package, comprising:

• a fan-out package comprising multiple functional dies;
• at least one dummy die free of active circuit, wherein the at least one dummy die comprises a semiconductor die that includes at least one capacitor device element;
• a redistribution layer (RDL) structure interconnecting the at least one capacitor device element to at least one of the multiple functional dies;
• and a molding compound encapsulating and surrounding the multiple functional dies and the at least one dummy die;
• a package substrate interconnecting to the RDL structure of the fan-out package through a plurality of first connecting elements comprising micro-bumps or pillars;
• and
• an underfill material filling a gap between the RDL structure and the package substrate, wherein the underfill material surrounds the plurality of first connecting elements.