Semiconductor module, method for manufacturing same, and semiconductor module mounting body

A semiconductor module including a plurality of stacked dies, comprising:

• a first die;
• a second die provided side by side with the first die in a direction intersecting a stacking direction;
• a third die that extends over the first die and the second die in the stacking direction, and is electrically connected to wiring surfaces of the first die and the second die opposite to the third die;
• at least one projecting terminal which projects from the wiring surfaces of the first die and the second die, and projects in a spatial region adjacent to at least one side surface of the third die in a direction intersecting the stacking direction;
• and
• a rewiring layer which overlaps the projecting terminal,
• wherein the second die comprises a plurality of second dies, and the second dies are provided in a pair with the first die interposed therebetween in a direction intersecting the stacking direction, and the third die comprises a plurality of third dies, and the third dies are provided in a pair, each of which extends over the first die and one of the paired second dies,
• the first die has a connection terminal extending from the wiring surface in the stacking direction, and the third die is directly connected to the first die via the connection terminal.