Method and system for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChe-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
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Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
Claims19
A method for manufacturing a semiconductor package structure, comprising:
- providing a package body including a semiconductor device encapsulated in an encapsulant;
- removing a portion of the encapsulant to expose a plurality of stud bumps disposed over an active surface of the semiconductor device;
- attaching a first tape to a first side of the package body;
- thinning the package body;
- attaching a second tape to a second side of the package body, opposite to the first side, before removing the first tape;
- and
- reducing an adhesive of the first tape earlier than attaching the second tape.
A method for manufacturing a semiconductor package structure, comprising:
- providing a package body including a semiconductor device encapsulated in an encapsulant;
- attaching a dicing tape to the package body;
- attaching an assembly of the package body and the dicing tape to a first chuck by a suction;
- turning over the assembly sucked on the first chuck;
- and
- forming a mark by a light irradiation passing through the dicing tape later than turning over the assembly sucked on the first chuck.
A method for manufacturing a semiconductor package structure, comprising:
- forming a package body on a carrier, wherein the package body includes a semiconductor device encapsulated in an encapsulant;
- attaching a back grinding (BG) tape to a first surface of the package body, wherein a second surface of the package body opposite to the first surface of the package body faces the carrier;
- attaching the carrier to a flattening chuck by a third suction later than attaching the back grinding (BG) tape to the first surface of the package body;
- attaching a combination of a dicing tape and a back side film to the package body;
- forming a mark on the back side film by a light irradiation passing through the dicing tape;
- and
- curing the back side film before forming the mark on the back side film, and after attaching the combination of the dicing tape and the back side film to the package body.
Dependencies are inferred from the claim text.