Chip package structure with ring-like structure

A chip package structure, comprising:

• a substrate;
• a first conductive bump over the substrate and having a first top surface facing away from the substrate;
• a first ring-like structure over the substrate and electrically insulated from the substrate, wherein the first ring-like structure surrounds the first conductive bump, and the first ring-like structure has a second top surface facing away from the substrate;
• and
• a chip bonded to the substrate, wherein the first top surface of the first conductive bump is closer to the chip than the second top surface of the first ring-like structure.

A chip package structure, comprising:

• a substrate has a first surface and a second surface opposite to the first surface;
• a chip over the first surface;
• a conductive bump over the second surface and having a first bottom surface facing away from the chip;
• and
• a ring-like structure over the second surface and electrically insulated from the substrate and the chip and having a second bottom surface facing away from the chip, wherein the ring-like structure surrounds the conductive bump, and the second bottom surface of the ring-like structure is closer to the chip than the first bottom surface of the conductive bump.