IC module and method of manufacturing IC module
AssigneeMurata Manufacturing Co., Ltd.
InventorNoboru Kato
Life of this patent
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Abstract
An IC module is provided that includes an IC having a terminal electrode, and a substrate having a first surface and a second surface opposite to each other and having a land formed on the first surface. Moreover, the land is connected to the terminal electrode of the IC. On the first surface of the substrate, an insulator layer that covers an area outside of a formation area of the land is formed. A difference between a thickness of the insulator layer and a thickness of the IC is smaller than a difference between the thickness of the insulator layer and a thickness of the substrate, and the thickness of the substrate is smaller than the thickness of the insulator layer.
Claims6
An IC module comprising:
- an IC having a terminal electrode;
- a substrate having a first surface and a second surface opposing the first surface;
- a land disposed on the first surface of the substrate and connected to the terminal electrode of the IC;
- and
- an insulator layer that covers an area outside of an area where the land is disposed on the first surface of the substrate,
- wherein a difference between a thickness of the insulator layer and a thickness of the IC is smaller than a difference between the thickness of the insulator layer and a thickness of the substrate,
- wherein the thickness of the substrate is smaller than the thickness of the insulator layer, and
- wherein the insulator layer comprises an opening disposed therethrough that is over the area where the land is disposed on the first surface of the substrate, and the IC is disposed in the opening.
An IC module comprising:
- an IC having a terminal electrode;
- a substrate having a first surface and a second surface opposing the first surface;
- a land disposed on the first surface of the substrate and connected to the terminal electrode of the IC;
- and
- an insulator layer that covers an area outside of an area where the land is disposed on the first surface of the substrate,
- wherein a difference between a thickness of the insulator layer and a thickness of the IC is smaller than a difference between the thickness of the insulator layer and a thickness of the substrate,
- wherein the thickness of the substrate is smaller than the thickness of the insulator layer, and
- wherein the thickness of the IC is larger than the thickness of the insulator layer.
Dependencies are inferred from the claim text.