Semiconductor package and method for manufacturing the same

A semiconductor package comprising:

• a first semiconductor chip having a bottom surface adjacent to a first active layer and a top surface opposite to the bottom surface;
• a first adhesive layer disposed on the top surface of the first semiconductor chip;
• a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer;
• a first conductive post disposed outside the first semiconductor chip;
• a redistribution structure disposed under the first semiconductor chip and comprising a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern;
• a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure,
• a second semiconductor chip disposed under the first semiconductor chip, having a cross-sectional area in a horizontal direction smaller than a cross-sectional area of the first semiconductor chip in the horizontal direction, and having a bottom surface adjacent to a second active layer and a top surface opposite to the bottom surface;
• a second adhesive layer disposed between the first semiconductor chip and the second semiconductor chip;
• a second conductive stud disposed on the bottom surface of the second semiconductor chip to be inside the first conductive stud as seen in a cross-sectional view and electrically connected to the second active layer;
• a support pad disposed on a top surface of the first adhesive layer;
• and
• a connection pad disposed on the first conductive post,
• wherein the redistribution pattern of the redistribution structure is connected to the second conductive stud,
• wherein the first conductive stud includes a portion that overlaps the second conductive stud and the first conductive post along the horizontal direction, and
• wherein a top surface of the molding layer, a top surface of the support pad, and a top surface of the connection pad are coplanar, and a bottom surface of the support pad is coplanar with the top surface of the first adhesive layer.