Embedded inductors and integrated voltage regulators for packaged semiconductor devices

A packaged semiconductor device comprising:

• an integrated circuit;
• and
• a package substrate on which the integrated circuit is mounted, the package substrate comprising:
• a first substrate core;
• an inductor embedded in the first substrate core, the inductor including a magnetic core embedded in the first substrate core and a conductive winding surrounding the magnetic core, the conductive winding including one or more first segments defined by metal patterning on the first substrate core;
• a second substrate core vertically stacked with the first substrate core;
• and
• a capacitor embedded in the second substrate core in vertical alignment with the inductor embedded in the first substrate core.

A package substrate for a semiconductor device, the package substrate comprising:

• a first substrate core;
• an inductor embedded in the first substrate core, the inductor including a magnetic core embedded in the first substrate core, an insulating material surrounding the magnetic core, and a conductive winding surrounding the magnetic core and including one or more first segments defined by metal patterning outside the insulating material;
• a second substrate core vertically stacked with the first substrate core;
• and
• a capacitor embedded in the second substrate core in vertical alignment with the inductor embedded in the first substrate core.