Semiconductor device and method using an EMI-absorbing metal bar
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsKyouYong Han, WonJung Kim, WoongHui Park
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Abstract
A semiconductor device has a substrate. A first semiconductor die and second semiconductor die are disposed over the substrate. A metal bar has an EMI-absorbing material disposed over the metal bar. The metal bar is disposed over the substrate between the first semiconductor die and second semiconductor die. An encapsulant is deposited over the first semiconductor die, second semiconductor die, and metal bar. A shielding layer is formed over the encapsulant.
Claims21
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a first semiconductor die and second semiconductor die over the substrate;
- providing a metal bar;
- disposing an EMI-absorbing material over the metal bar;
- disposing the metal bar over the substrate between the first semiconductor die and second semiconductor die after disposing the EMI-absorbing material over the metal bar;
- depositing an encapsulant over the first semiconductor die, second semiconductor die, and metal bar;
- and
- forming a shielding layer over the encapsulant.
A method of making a semiconductor device, comprising:
- providing a substrate;
- disposing a first electronic component and second electronic component over the substrate;
- providing a metal bar;
- disposing an EMI-absorbing material over the metal bar to form an EMI-absorbing metal bar;
- and
- disposing the metal bar over the substrate between the first electronic component and second electronic component after disposing the EMI-absorbing material over the metal bar.
A method of making a semiconductor device, comprising:
- providing a substrate;
- providing a metal bar;
- disposing an EMI-absorbing material over the metal bar to form an EMI-absorbing metal bar;
- and
- disposing the metal bar over the substrate after disposing the EMI-absorbing material over the metal bar.
Dependencies are inferred from the claim text.