US 12,183,684 B2 · Semiconductor device packaging methods

Abstract

The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor device package. In certain embodiments, a glass or silicon substrate is patterned by laser ablation to form structures for subsequent formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor device package, which may have one or more embedded dies therein. In certain embodiments, an insulating layer is formed over the substrate by laminating a pre-structured insulating film thereon. The insulating film may be pre-structured by laser ablation to form structures therein, followed by selective curing of sidewalls of the formed structures.

Claims18

Dependent claims

A method of forming a semiconductor device package, comprising:

placing a pre-structured insulating film over a patterned substrate, the pre-structured insulating film comprising a flowable, polymer-based dielectric material, wherein
the patterned substrate comprises one or more features formed in a silicon substrate, the one or more features comprising a first via and a cavity, wherein a semiconductor die is placed into the cavity prior to placement of the pre-structured insulating film over the patterned substrate, and
the pre-structured insulating film further comprising a second via formed therein, the second via aligned with the first via upon placement of the pre-structured insulating film;
laminating the pre-structured insulating film onto the patterned substrate;
curing the pre-structured insulating film;
and
forming a conductive layer extending through the first via and the second via.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor device packaging methods

Life of this patent

Semiconductor device packaging methods

Life of this patent

Abstract

Claims18