Electronic package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen
Life of this patent
Estimating the term…
Abstract
An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.
Claims8
An electronic package structure comprising:
- an electronic structure including an encapsulant encapsulating a semiconductor element;
- a wiring structure located over the electronic structure;
- an electrical contact connecting the wiring structure and the electronic structure, wherein the electrical contact includes a first side and a second side opposite to the first side;
- and
- a support layer disposed on the encapsulant and around the electrical contact, wherein, in a cross-sectional view, the semiconductor element is exposed by an opening defined by the support layer and dividing the support layer into a first portion and a second portion spaced apart from the first portion, the first side of the electrical contact is not exposed by the first portion of the support layer, and the second side of the electrical contact is partially exposed by the support layer, wherein the support layer is further around a second electrical contact, the second electrical contact includes a first side and a second side opposite to the first side of the second electrical contact, the first side of the second electrical contact faces the first side of the electrical contact, the first side of the second electrical contact is not exposed by the second portion of the support layer.
An electronic package structure comprising:
- an electronic structure including an encapsulant encapsulating a semiconductor element;
- a wiring structure located over the electronic structure;
- an interlayer disposed on the encapsulant;
- and
- a gap located between the wiring structure and the electronic structure, and including a space accommodating the interlayer and a channel dividing the interlayer into a first portion and a second portion, wherein an area of the first portion of the interlayer is different from an area of the second portion of the interlayer in a top view, wherein, in the top view, the interlayer further includes a third portion separated from the first portion and the second portion, and wherein the first portion, the second portion and the third portion are disposed around the semiconductor element.
An electronic package structure comprising:
- an electronic structure including an encapsulant encapsulating a semiconductor element and an underfill partially encapsulating the semiconductor element;
- a wiring structure located over the electronic structure;
- an interlayer disposed on the encapsulant;
- and
- a gap located between the wiring structure and the electronic structure, and including a space accommodating the interlayer and a channel dividing the interlayer into a first portion and a second portion, wherein an area of the first portion of the interlayer is different from an area of the second portion of the interlayer in a top view;
- wherein a top surface of the underfill is exposed in the channel.
Dependencies are inferred from the claim text.