Three-dimensional semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-Hun Lee, Seokjung Yun, Chang-Sup Lee, Seong Soon Cho, Jeehoon Han
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AssigneeSamsung Electronics Co., Ltd.
InventorsSung-Hun Lee, Seokjung Yun, Chang-Sup Lee, Seong Soon Cho, Jeehoon Han
Estimating the term…
A three-dimensional (3D) semiconductor device includes a stack structure including first and second stacks stacked on a substrate. Each of the first and second stacks includes a first electrode and a second electrode on the first electrode. A sidewall of the second electrode of the first stack is horizontally spaced apart from a sidewall of the second electrode of the second stack by a first distance. A sidewall of the first electrode is horizontally spaced apart from the sidewall of the second electrode by a second distance in each of the first and second stacks. The second distance is smaller than a half of the first distance.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.