Configurable metal—insulator—metal capacitor and devices
AssigneeMACOM Technology Solutions Holdings, Inc.
InventorJeremy Fisher
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Abstract
A metal-insulator-metal (MIM) capacitor component that includes a substrate, where the metal-insulator-metal (MIM) capacitor component is configured to form a first capacitor with a top metal and a first bottom metal having a dielectric layer therebetween; and where the metal-insulator-metal (MIM) capacitor component is configured to form a second capacitor with the top metal and a second bottom metal having the dielectric layer therebetween. Additionally, the top metal, the dielectric layer, the first bottom metal, and the second bottom metal are arranged on the substrate.
Claims28
A metal-insulator-metal (MIM) capacitor component comprising:
- a substrate;
- a first bottom metal arranged on the substrate;
- a second bottom metal arranged on the substrate;
- a dielectric layer arranged on the first bottom metal and the second bottom metal;
- a top metal arranged on the dielectric layer;
- a first metallization layer electrically coupled to the first bottom metal and arranged beneath the substrate;
- and
- a second metallization layer electrically coupled to the second bottom metal and arranged beneath the substrate,
- wherein the first metallization layer and the second metallization layer are located on a lower surface of the substrate;
- wherein the metal-insulator-metal (MIM) capacitor component is configured to form a first capacitor with the top metal and the first bottom metal having the dielectric layer therebetween;
- wherein the metal-insulator-metal (MIM) capacitor component is configured to form a second capacitor with the top metal and the second bottom metal having the dielectric layer therebetween;
- and
- wherein the top metal, the dielectric layer, the first bottom metal, and the second bottom metal are arranged on the substrate.
A metal-insulator-metal (MIM) capacitor component comprising:
- a substrate;
- a first bottom metal arranged on the substrate;
- a second bottom metal arranged on the substrate;
- a dielectric layer arranged on the first bottom metal and the second bottom metal;
- a top metal arranged on the dielectric layer;
- a first metallization layer electrically coupled to the first bottom metal and arranged beneath the substrate;
- and
- a second metallization layer electrically coupled to the second bottom metal and arranged beneath the substrate,
- wherein the first metallization layer and the second metallization layer are located on a lower surface of the substrate;
- wherein the top metal and the first bottom metal are configured to form a first capacitor;
- wherein the top metal and the second bottom metal are configured to form a second capacitor;
- and
- wherein the top metal, the dielectric layer, the first bottom metal, and the second bottom metal are arranged on the substrate.
Dependencies are inferred from the claim text.