US 12,183,665 B2 · Semiconductor package

Abstract

Disclosed is a semiconductor package comprising a package substrate, an interposer substrate on the package substrate and including a first redistribution substrate, a second redistribution substrate on a bottom surface of the first redistribution substrate, and an interposer molding layer between the first redistribution substrate and the second redistribution substrate, a connection substrate on the interposer substrate and having a connection hole that penetrates the connection substrate, a first semiconductor chip on the interposer substrate and in the connection hole, a second semiconductor chip on the interposer substrate, in the connection hole and horizontally spaced apart from the first semiconductor chip, and a connection semiconductor chip in the interposer molding layer and on the bottom surface of the first redistribution substrate.

Claims20

Dependent claims

A method of manufacturing a semiconductor package, comprising:

providing a carrier substrate having a connection hole on a first carrier substrate;
providing first and second semiconductor chips in the connection hole on the first carrier substrate;
forming a molding layer covering the carrier substrate and upper surfaces of the first and second semiconductor chips;
attaching a second carrier substrate on the molding layer;
removing the first carrier substrate;
turning the second carrier substrate to allow lower surfaces of the first and second semiconductor chips to face upwards;
forming a first redistribution substrate on the lower surfaces of the first and second semiconductor chips;
mounting a connection semiconductor chip and a capacitor chip on the first redistribution substrate, the capacitor chip horizontally spaced apart from the connection semiconductor chip;
forming an interposer molding layer covering upper surfaces of the connection semiconductor chip;
and
forming a second redistribution substrate on the interposer molding layer.

8 more elements

A method of manufacturing a semiconductor package, comprising:

providing a carrier substrate having a connection hole on a first carrier substrate;
providing first and second semiconductor chips in the connection hole on the first carrier substrate;
forming a preliminary molding layer covering the carrier substrate and upper surfaces of the first and second semiconductor chips;
attaching a second carrier substrate on the preliminary molding layer;
removing the first carrier substrate;
turning the second carrier substrate to allow lower surfaces of the first and second semiconductor chips to face upwards;
forming a first redistribution substrate including a first redistribution dielectric layer and first redistribution patterns in the first redistribution dielectric layer, on the lower surfaces of the first and second semiconductor chips;
forming conductive patterns connected to the first redistribution patterns on the first redistribution substrate;
forming conductive posts on the conductive patterns on an edge region of the first redistribution substrate;
mounting a connection semiconductor chip connected to the conductive patterns and a capacitor chip horizontally spaced apart from the connection semiconductor chip on a center region of the first redistribution substrate;
forming an interposer molding layer covering upper surfaces of the connection semiconductor chip;
forming a second redistribution substrate including a second redistribution dielectric layer and second redistribution patterns in the second redistribution dielectric layer, on the interposer molding layer,
turning the second carrier substrate again to allow the lower surfaces of the first and second semiconductor chips to face downwards;
removing the second carrier substrate;
and
forming a molding layer by grinding the preliminary molding layer to expose upper surfaces of the first and second semiconductor chips.

13 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims20