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US 12,183,662 B2Granted
Signal isolator having enhanced creepage characteristics
AssigneeAllegro MicroSystems, LLC
InventorsRobert A. Briano, Shixi Louis Liu, William P. Taylor
Life of this patent
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Abstract
Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, an isolator includes a leadframe having first and second die paddles each having opposed first and second surfaces, a first die supported by the first surface of the first die paddle, and a second die supported by the first surface of the second die paddle. The first and second die paddles are configured enhanced creepage characteristics.
Claims12
A leadless signal isolator IC package, comprising:
- a leadframe having first and second die paddles each having opposed first and second surfaces;
- a first die supported by the first surface of the first die paddle;
- and
- a second die supported by the first surface of the second die paddle,
- wherein the second surface of the first die paddle is exposed on an exterior surface of the package, and wherein the second surface of the second die paddle is exposed on the exterior surface of the package,
- wherein the first die has a first width and the second die has a second width,
- wherein a width of the second surface of the first die paddle is less than the first width of the first die along an entire length of the first die and edges of the first die along the length of the first die are outside of edges of the exposed second surface of the first die paddle, and
- wherein a width of the first surface of the first die paddle is greater than the first width of the die along the entire length of the first die.
5 more elements
A method for providing a leadless signal isolator IC package, comprising:
- employing a leadframe having first and second die paddles each having opposed first and second surfaces;
- employing a first die supported by the first surface of the first die paddle;
- and
- employing a second die supported by the first surface of the second die paddle,
- wherein the second surface of the first die paddle is exposed on an exterior surface of the package, and wherein the second surface of the second die paddle is exposed on the exterior surface of the package,
- wherein the first die has a first width and the second die has a second width,
- wherein a width of the second surface of the first die paddle is less than the first width of the first die along an entire length of the first die and edges of the first die along the length of the first die are outside of edges of the exposed second surface of the first die paddle, and
- wherein a width of the first surface of the first die paddle is greater than the first width of the die along the entire length of the first die.
5 more elements
Dependencies are inferred from the claim text.