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US 12,183,656 B2Granted
Thermally conductive sheet and method of manufacturing semiconductor device
AssigneeResonac Corporation
InventorsMika Kobune, Michiaki Yajima
Life of this patent
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Abstract
A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.
Claims2
A semiconductor device, comprising:
- a thermally conductive sheet having a compression modulus of from 0.50 to 1.40 MPa under a compressive stress of 0.10 MPa at 150° C.,
- the thermally conductive sheet adhering together a heat dissipating body and a plurality of heat generating bodies of the semiconductor device, by being disposed between the heat dissipating body and the plurality of heat generating bodies.
Dependencies are inferred from the claim text.