Semiconductor device

A semiconductor device, comprising:

• a substrate;
• a semiconductor chip on a first side of the substrate;
• a lid on the first side of the substrate and over the semiconductor chip, wherein the lid comprises:
• a fixing part coupled to the first side of the substrate;
• a protrusion part coupled to the first side of the substrate between the fixing part and the semiconductor chip;
• and
• a recessed groove between the semiconductor chip and the protrusion part, wherein a thickness of the lid at the recessed groove is less than a thickness of the lid at a central portion of the lid located over the semiconductor chip, and the central portion of the lid extends beyond a footprint of the semiconductor chip;
• a thermal interface material (TIM) between the central portion of the lid and the semiconductor chip;
• and
• an underfill between the semiconductor chip and the first side of the substrate, wherein the underfill fully covers a lateral side of the semiconductor chip, and a top side of the underfill is flush with a top side of the semiconductor chip.

A semiconductor device, comprising:

• a substrate;
• a semiconductor chip on a first side of the substrate;
• a lid on the first side of the substrate and over the semiconductor chip, wherein the lid comprises:
• a fixing part coupled to the first side of the substrate;
• a central portion over the semiconductor chip;
• and
• a recessed groove between the central portion and the fixing part, wherein a thickness of the lid at the recessed groove is less than a thickness of the lid at the central portion of the lid and less than a thickness of the lid adjacent to the fixing part;
• an underfill between the semiconductor chip and the first side of the substrate;
• and
• a thermal interface material (TIM) between the central portion of the lid and the semiconductor chip;
• wherein the underfill covers a lateral side of the semiconductor chip and a top side of the underfill is at a same level as a top side of the semiconductor chip.