Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver

An optical transceiver package, comprising:

• a printed circuit board assembly (PCBA);
• a ceramic carrier or a silicon interposer mounted to the PCBA;
• a laser die mounted to the ceramic carrier or the silicon interposer;
• and
• a heat extraction path away from the laser die, the heat extraction path comprising:
• an integrated passive device (IPD) on a first portion of the laser die;
• a heat sink die (HSD) over a second portion of the laser die;
• a thermal interface material over both the IPD and the HSD;
• a copper integrated heat spreader (IHS) over the thermal interface material;
• a ceramic carrier plate over the copper integrated heat spreader;
• and
• an electrically conductive thermal gap pad between the ceramic carrier plate and a housing of the optical transceiver package.