Semiconductor device and semiconductor module

A semiconductor module comprising:

• a first member having a first surface and including a plurality of circuit blocks disposed in an inner region of the first surface when the first surface is viewed in plan;
• a second member joined to the first surface of the first member in surface contact with the first surface, the second member including one or more circuit blocks;
• a first conductive protrusion protruding from the first surface of the first member;
• a second conductive protrusion protruding from the second member in a same direction as the first conductive protrusion;
• and
• a module substrate on which the first member and the second member are mounted,
• wherein one of the circuit blocks in the second member constitutes a first amplifier circuit including a plurality of first transistors that are connected in parallel to each other,
• at least one of the circuit blocks in the first member overlaps at least one circuit block in the second member in a plan view, and
• the circuit block in the first member and the circuit block in the second member, which overlap in a plan view, are connected to each other via the first conductive protrusion, the second conductive protrusion, and a wiring disposed in or on the module substrate.