Wafer processing method and wafer processing apparatus

A wafer processing apparatus which divides a wafer along a plurality of crossing division lines to obtain a plurality of individual device chips, the division lines being formed on a front side of the wafer to thereby define a plurality of separate regions where a plurality of devices are individually formed, the wafer being positioned in an opening of a frame, the opening for accommodating the wafer, an adhesive sheet being attached to the front side of the wafer and to a back side of the frame, thereby uniting the wafer with the frame through the adhesive sheet, the wafer processing apparatus comprising:

• a supporting unit including a wafer table having a transparent plate and a front side and a rear side, the front side of the wafer table including a supporting face configured for supporting the wafer;
• a liquid layer forming unit including a nozzle section and forming a layer of a liquid on the supporting face of the wafer table, wherein the adhesive sheet attached to the front side of the wafer is placed on the layer of the liquid;
• an imaging unit including an imaging camera positioned adjacent to the rear side of the wafer table and opposite to the supporting face on the front side of the wafer table;
• and
• an air blowing nozzle blowing air to a region between the wafer table and the adhesive sheet.