Semiconductor structure comprising an air chamber and method of manufacturing the same
AssigneeChangxin Memory Technologies, Inc.
InventorJingwen Lu
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AssigneeChangxin Memory Technologies, Inc.
InventorJingwen Lu
Estimating the term…
The present disclosure provides a method of manufacturing a semiconductor structure and a semiconductor structure. The method of manufacturing a semiconductor structure includes: providing a base, wherein the base includes an active region and a shallow trench isolation structure separating the active region, a word line trench is formed in the base, and the word line trench exposes a part of the active region and the shallow trench isolation structure; forming a first intermediate structure in the word line trenches, wherein the first intermediate structure covers side walls and a bottom wall of the word line trench, a first trench is formed in the first intermediate structure, the first intermediate structure includes a sacrificial structure, and the sacrificial structure includes a horizontal portion; and removing the horizontal portion of the sacrificial structure, and closing the first trench, and forming an air chamber.
A method of manufacturing a semiconductor structure, comprising:
A semiconductor structure, wherein the semiconductor structure comprises:
Dependencies are inferred from the claim text.