In-situ semiconductor processing chamber temperature apparatus

A showerhead assembly, comprising:

• a gas distribution plate having a plurality of through-holes operable to deliver process gases to a processing chamber and being divided into a plurality of temperature-control regions;
• a bottom plate coupled to the gas distribution plate and comprising a plurality of holes;
• a bonding layer disposed between the gas distribution plate and the bottom plate;
• a plurality of independently addressable thermoelectric modules disposed above the bottom plate and operable to manage heat transfer independently in each of the plurality of the temperature-control regions, the plurality of the thermoelectric modules being configured to cool and heat the temperature-control regions;
• a chill plate being a lid of the showerhead assembly and comprising a recess portion housing the plurality of the thermoelectric modules, the thermoelectric modules separating the chill plate from the gas distribution plate;
• and
• a plurality of heat pipes extending from the plurality of the thermoelectric modules into the plurality of the holes of the bottom plate, the plurality of thermoelectric modules comprising a first thermoelectric module being disposed between a first heat pipe and the chill plate, and the bonding layer being disposed between the first heat pipe and the gas distribution plate.