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US 12,183,595 B2Granted
Selective underfill assembly and method therefor
AssigneeNXP B.V.
InventorsLeo van Gemert, Peter Joseph Hubert Drummen
Life of this patent
Estimating the term…
Abstract
A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.
Claims20
An assembly comprising:
- a substrate having a plurality of conductive pads;
- a packaged semiconductor device having a plurality of pins, the packaged semiconductor device attached to the substrate such that a plurality of conductive connections is formed with the plurality of pins and the plurality of conductive pads;
- an isolation structure disposed between the packaged semiconductor device and the substrate, the isolation structure configured to separate a first region from a second region;
- and
- an underfill material disposed in the first region between the packaged semiconductor device and the substrate, the underfill material prevented by way of the isolation structure from reaching the second region between the packaged semiconductor device and the substrate, at least one conductive connection of the plurality of conductive connections located in the second region.
2 more elements
An assembly comprising:
- a packaged semiconductor device attached to a substrate;
- a plurality of conductive connections formed between the packaged semiconductor device and the substrate, the conductive connections in the plurality of conductive connections orthogonally arranged in rows and columns;
- an isolation structure located between the packaged semiconductor device and the substrate, the isolation structure configured and arranged to serve as a barrier between an underfill material and a first conductive connection of the plurality of conductive connections;
- and
- the underfill material disposed between the packaged semiconductor device and the substrate, the underfill material prevented by way of the isolation structure from contacting the first conductive connection.
2 more elements
An assembly comprising:
- a substrate having a plurality of conductive pads;
- a packaged semiconductor device having a plurality of pins, the packaged semiconductor device attached to the substrate such that a plurality of conductive connections is formed with the plurality of pins and the plurality of conductive pads;
- an isolation structure disposed in a gap between the packaged semiconductor device and the substrate, the isolation structure separating a first region from a second region;
- and
- an underfill material disposed in the first region between the packaged semiconductor device and the substrate, the isolation structure configured and arranged to serve as a barrier between the underfill material and a first conductive connection of the plurality of conductive connections, the underfill material prevented by way of the isolation structure from contacting the first conductive connection located in the second region.
2 more elements
An assembly comprising:
- a packaged semiconductor device attached to a substrate;
- a plurality of conductive connections formed between the packaged semiconductor device and the substrate;
- an isolation structure located between the packaged semiconductor device and the substrate, the isolation structure configured and arranged to serve as a barrier between an underfill material and a first conductive connection of the plurality of conductive connections, the isolation structure conductively connected to a ground supply terminal at the substrate;
- and
- the underfill material disposed between the packaged semiconductor device and the substrate, the underfill material prevented by way of the isolation structure from contacting the first conductive connection.
2 more elements
Dependencies are inferred from the claim text.