Manufacturing method for manufacturing a package structure

A manufacturing method, comprising:

• (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface;
• (b) forming an under layer on the carrier to at least partially expose the flat portion;
• (b1) forming a first seed layer on the under layer;
• (b2) removing a portion of the first seed layer to expose a second peripheral portion of the under layer;
• and
• (c) forming a dielectric layer on the under layer and covering the exposed flat portion.