Integrated aligned stealth laser for wafer edge trimming process

An integrated chip fabrication device, comprising:

• a laser apparatus within a housing and over a chuck, the chuck being configured to receive a multi-tier integrated chip structure comprising a first semiconductor substrate and a second semiconductor substrate stacked over the first semiconductor substrate;
• an infrared camera within the housing and operably coupled to the laser apparatus, the infrared camera being configured to detect an alignment mark on the first semiconductor substrate, wherein the alignment mark is used to align the laser apparatus;
• and
• wherein the laser apparatus is configured to form a damage region within the second semiconductor substrate, the damage region separating an inner region of the second semiconductor substrate from an outer region of the second semiconductor substrate.

An integrated chip fabrication device, comprising:

• a substrate holder arranged within a processing chamber and configured to hold a multi-tier integrated chip structure comprising a first semiconductor tier and a second semiconductor tier stacked over the first semiconductor tier;
• an alignment tool arranged within the processing chamber and in communication with a laser apparatus configured to damage the second semiconductor tier between an inner region and an outer region, wherein the alignment tool is used to align the laser apparatus with respect to an alignment mark;
• and
• a blade arranged within the processing chamber and in communication with the alignment tool, wherein the alignment tool is used to align the blade with respect to the alignment mark so that the blade is configured to contact the outer region of the second semiconductor tier.