Baffle implementation for improving bottom purge gas flow uniformity

A processing chamber comprising:

• a lid, sidewalls, and a substrate support collectively defining a processing volume;
• a bottom bowl comprising a first equalizer hole disposed therethrough;
• a chamber base, the chamber base and bottom bowl collectively defining a purge volume disposed beneath the processing volume, the chamber base comprising a purge port couplable to a purge gas line for supplying a purge gas to the purge volume via the purge port;
• a bellows configured to maintain a vacuum integrity of a portion of an internal volume between the substrate support and the bottom bowl, the bellows circumscribing a support shaft to define a passage and coupled to the radially outward edge of the substrate support, wherein the passage is radially surrounding the bellows, and wherein the internal volume comprises the processing volume and the purge volume;
• the passage positioned above the first equalizer hole, coupled to the processing volume via an inlet, and coupled to the purge volume via the first equalizer hole, and wherein the chamber base has a second purge port couplable to a second purge gas line for supplying the purge gas to the purge volume via the second purge port;
• a baffle disposed in the purge volume at a height above the first purge port and the second purge port.

A processing chamber comprising:

• a lid, sidewalls, and a substrate support collectively defining a processing volume;
• a bottom bowl comprising a first equalizer hole disposed therethrough;
• a chamber base, the chamber base and bottom bowl collectively defining a purge volume disposed beneath the processing volume, the chamber base comprising a purge port couplable to a purge gas line for supplying a purge gas to the purge volume via the purge port;
• a first bellows configured to maintain a vacuum integrity of a portion of an internal volume between the substrate support and the bottom bowl, the first bellows circumscribing a support shaft to define a passage and coupled to the radially outward edge of the substrate support, wherein the passage is radially surrounding the first bellows, and wherein the internal volume comprises the processing volume and the purge volume;
• the passage positioned above the first equalizer hole, coupled to the processing volume via an inlet, and coupled to the purge volume via the first equalizer hole;
• and
• a second bellows disposed in the purge volume, wherein the purge volume is defined by the second bellows, the chamber base, the bottom bowl, and the sidewalls;
• a baffle disposed in the purge volume at a height above the purge port, wherein the baffle is configured to deflect a trajectory of the purge gas entering the purge volume;
• wherein the baffle is configured to reduce a velocity of the purge gas at the first equalizer hole to less than 20 percent of the velocity of a purge gas jet at the purge port.